Basic composite materials, construction, and repair. Manufacturing methods and equipment. Assessment and repair of composite structures using vacuum bagging and other approved procedures. Corrosion control, electrical bonding, materials substitutions, machining of composite components, mold fabrication. Hot bond repair of composite components including complex shapes and varied materials. Prerequisites: None.

Introduction to semiconductor manufacturing concepts, processes, and hands-on application. Includes electrical theory, circuits, schematics, hand tools, safety, clean room protocols, model based problem solving, lean manufacturing, vacuum technology, and troubleshooting. Prerequisites: None.